FL30P2020,P-Channel 30V-WLCSP Power MOSFET
DESCRIPTION
True wafer level chip-scale packaging is available from Fangjing. The WLCSP package is one-fifty-eighth the footprint of a comparable SOP-8 package and has a profile of less than 0.25mm. The device has been designed to deliver the lowest on resistance and gate charge in the smallest outline possible with excellent thermal characteristics in an ultra-low profile.
FEATURES
• Power MOSFET Technology
• Ultra Low Qg and Qgd, High Speed.
• Single P-channel MOSFET
• Small Footprint 2.0mm × 2.0mm
• Low Profile 0.25mm Height
• Pb Free / RoHS Compliant
• WLCSP Package
APPLICATIONS
• Power Management
• Load Switch
• Battery Protection
• DC/DC Converter
• LCD Display
